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ELECTROPLATING CHEMICALS

INCI Name Cas No Application
POLYQUATERNIUM 2 68555-36-2 USED AS A LEVELING AGENT IN ALKALINE ZINC AND ACIDIC COPPER BATHS
BENZYLIDENE ACETONE 122-57-6 ELECTROPLATING, ESPECIALLY FOR ZINC, AS A BRIGHTENER AND LEVELING AGENT
SODIUM CUMENE SULFONATE 28348-530 DETERGENT FORMULATION
BENZYL PYRIDINIUM-3-CARBOXYLATE 15990-43-9 USED AS A KEY ADDITIVE IN ALKALINE ZINC ELECTROPLATING
HYDROXY SULPHONATE PROPYL PYRIDINIUM 3918-73-8 ELECTROPLATING INTERMEDIATE AND ADDITIVE, PRIMARILY IN THE NICKEL PLATING INDUSTRY
SODIUM ALLYL SULFONATE 2495-39-8 PRIMARILY USED IN NICKEL PLATING BATHS AS A BRIGHTENER, LEVELING AGENT AND DUCTILITY ENHANCER
3-UREIDOPROPANOIC ACID 462-88-4 USED IN ELECTROPLATING AS A THIOLATED ADDITIVE, PRIMARILY FUNCTION AS AN ACCELERATOR IN ACID COPPER PLATING BATHS
STANNOUS SULFATE 7488-55-3 CRUCIAL IN ELECTROPLATING AS THE PRIMARY TIN ION SOURCE FOR ACID TIN PLATING BATHS
META NITROBENZENE SULFONATE (MNBS) 127-68-4 OXIDIZING AGENT, NICKEL STRIPPER AND DEVELOPING AGENT, IMPROVING SURFACE PREPARATION FOR PLATING
TIN OXIDE 18282-10-5 COATINGS (ANTI-STATIC, HEAT-REFLECTIVE, ANTI-CORROSIVE), CATALYSTS
STANNOUS OXIDE 21651-19-4 PRECURSOR FOR OTHER TIN COMPOUNDS, A CATALYST, AND IN CERAMICS AND GLASS (AS AN OPACIFIER/PIGMENT)